Apple Signs $30 Billion Broadcom Deal to Boost US Chip Manufacturing

Apple Inc. has entered into a multi-year chip supply agreement worth more than $30 billion with Broadcom Inc. to strengthen semiconductor manufacturing in the United States. The agreement, which will remain in effect through 2031, covers the design and production of custom silicon components and FBAR radio-frequency filters that enable wireless connectivity across Apple devices. The partnership aligns with ongoing efforts to expand domestic chip manufacturing and build a stronger US-based semiconductor supply chain.

Under the agreement, Broadcom is expected to manufacture more than 15 billion chips in the United States while supporting hundreds of new jobs. The company will also invest $1.5 billion to expand its manufacturing facility in Fort Collins, Colorado. Apple CEO Tim Cook said the investment reflects the company's commitment to innovation and American manufacturing. The partnership is also part of Apple's broader plan to invest $600 billion in the US economy over the next four years through manufacturing, technology, and employment initiatives.