

MediaTek has announced that it will showcase its next generation AI and connectivity technologies at the “AI For Life: From Edge to Cloud” event during Mobile World Congress (MWC) 2026 on March 4. Led by President Joe Chen, the keynote will highlight breakthroughs in 6G research, 5G-Advanced CPE with Wi-Fi 8, automotive connectivity, flagship smartphone AI, and data centre infrastructure. The company aims to demonstrate how AI can seamlessly integrate from edge devices to cloud platforms.
A major highlight of the event will be the world’s first 6G radio interoperability demonstration, designed to balance throughput, latency, and power efficiency while supporting generative and agentic AI services. MediaTek will also introduce its “personal device cloud” concept, enabling AI agents to collaborate securely across personal and family devices via Wi-Fi or 6G. Additionally, the company will present AI accelerated uplink transmit diversity technology for 6G, promising improved performance compared to traditional systems.
MediaTek will also unveil the world’s first 5G-Advanced CPE device with Wi-Fi 8, powered by the T930 and Filogic 8000 chipsets, offering improved spectrum efficiency and faster uplink speeds. In automotive technology, it plans to demonstrate a 5G NR NTN video call and introduce a new Dimensity Auto smart cockpit platform built on a 3nm process. The event will further feature AI-powered glasses using the Dimensity 9500 and advanced data centre solutions, including UCIe-Advanced IP and co-packaged optics technology, reinforcing MediaTek’s commitment to accelerating AI adoption across industries.




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